OBC-64

Ultimate onboard computing based on Microchip PIC64

PIONEERING SPACECRAFT COMPUTING

We are pioneering the next generation of spacecraft avionics with our new Onboard Computer (OBC) built around Microchip’s cutting-edge PIC64 architecture. As an official Microchip Design Partner and a participant in the High-Performance Spaceflight Computing (HPSC) program, we benefit from early access to PIC64 technology—allowing us to engineer a robust, radiation-tolerant, and high-performance OBC platform designed for the most demanding space missions. Our mission is simple: deliver reliable, intelligent, and future-proof onboard computing capabilities for modern spacecraft and aerospace systems.

Powered by Microchip PIC64 – leveraging early-access silicon for advanced performance and reliability.
Radiation-tolerant architecture designed for harsh space environments.
High-speed data handling with next-gen interfaces for payloads, sensors, and spacecraft systems.
Modular, scalable platform adaptable to LEO, MEO, GEO, and deep-space mission profiles.
Designed with aerospace-grade robustness for long-duration missions and mission-critical operations.
Backed by Microchip Design Partner expertise ensuring tightly integrated hardware and firmware solutions.
Built within the HPSC ecosystem, aligning with the future standards of spaceflight computing.

KEY FEATURES

Mass: 650 g including conduction plate & housing
Dimensions: ~100 × 160 × 25 mm (3U SpaceVPX)
Power: 8–15 W typical, up to 25 W peak
Processor:
- PIC64-HPSC1000/1100
- 8× RISC-V X280 vector cores + S7 system controller
Performance:
- ~8,000+ DMIPS
- up to 1 TFLOPS (bf16) / 2 TOPS (INT8)
RAM / Mass Memory:
- DDR4 ECC up to 32 GB
- eMMC, SPI/QSPI Flash, NAND/NOR, MRAM
High-Speed I/O: 4× 10 GbE TSN, PCIe Gen3 ×8
SpaceWire: 7× ports (RMAP, 10–200 Mbps)
Software:
- Linux®, RTEMS, Xen, FreeRTOS
- AI/Vector libraries: OpenMP, OpenBLAS, OpenCL/PoCL, TensorFlow
Thermal: Conduction-cooled, −55°C to +125°C (RT/RH)
Lifetime / TID: 15–20 years, 50–100 krad, SEL 42–78 MeV