OBC-Hyper Polar
OBC-Hyper Polar
The OBC-Hyper Polar is a cutting-edge onboard computer specifically designed for Cubesat missions. Leveraging the powerful and reliable Microchip PolarFire SoC FPGA technology, this space OBC provides exceptional performance and versatility for space applications. Whether your mission involves scientific research, Earth observation, or commercial satellite deployment, the OBC-Polar ensures optimal performance and reliability in the harsh conditions of space.
MEETING COMPUTING NEEDS
- High-Performance Computing: Demanding applications like onboard image processing, data analysis, and autonomous operations.
- Complex Missions: Missions requiring extensive software frameworks, real-time operating systems, and diverse payload interfaces.
- Long-Duration Missions: Applications where reliability and radiation hardening are critical for long-term success.
CUBESAT MISSION CHOICE
If your mission demands high-performance computing, complex software frameworks, or long-duration reliability, the OBC-Hyper Polar is the answer. Its unmatched processing power, extensive memory options, comprehensive interface selection, and robust radiation hardening make it the ideal onboard computer for pushing the boundaries of CubeSat capabilities.
KEY FEATURES
- Microchip PolarFire SoC FPGA — two variants: MPFS250T (254k LE) & MPFS460T (461k LE)
- RISC-V MSS: 4× 64-bit U54 application cores + 1× E51 monitor core; >4,000 DMIPS
- Flash-based FPGA fabric — ZeroFIT SEU immunity; inherently non-volatile (no external boot PROM required)
- DDR4 SDRAM (Fabric) 8 GB 72-bit ECC Enabled
- LPDDR4 SDRAM (MSS) 4 GB 32-bit
- Dual 256 GB eMMC (one on MSS SDIO, one on fabric SDIO)
- Dual 512 Mbit QSPI NOR Flash (primary + redundant boot/config)
- 4 Mbit SPI MRAM SEU Immune
- 4× RS-422 full-duplex serial
- 4× RS-232 serial
- 4× CAN
- 4× RS-485
- 32× buffered GPIO (GPIOB [1…32]) in 4 banks + 8× buffered bidirectional I/O (IO [1…8]) + 8× Direct-IO
- 1× I2C
- 2× LVDS differential pairs (SpaceWire ECSS-E-ST-50-12C compatible)
- 2× Gigabit Ethernet
- Up to 4× additional GbE via 6-Ethernet addon card (total 6× GbE)
- 16-channel, 16-bit ADC (simultaneous sampling, ±5 V / ±10 V factory-selectable)
- USB 2.0 (PolarFire SoC native)
- USB-to-UART debug (dual channel)
- JTAG (FlashPro5/6 compatible)
- 8× SerDes transceivers (up to 12.7 Gbps each)
- Configurations: PCIe, CoaXpress, CSI-2, NVMe, USB3.0, Ethernet 10G
- Input voltage: 8 V to 28 V DC; OVP and UVLO factory-programmable
- 2-pin power connector (Glen Air GMPM2-B112R-CBRT-SU)
- Dual-redundant on-card DC-DC regulators
- Hardware watchdog timer
- Chassis: AL7075-T6, Dimensions: 110 × 181 mm, height: 22.5 mm / 35.5 mm
- Mass: 600 gr, <1,000 gr (with addon card)
- All I/O connectors: Micro-D (MIL-DTL-83513 family); Power connector: GlenAir GMPM2
- Software Support: Linux, FreeRTOS, Bare-Metal, etc.
- Paired with the NVIDIA Jetson Orin AGX 64GB for AI/ML Edge Computing. Typhoon Edge
- Radiation Tolerant Variations
SPECIAL FEATURES
- Expected Life-time: 3 to 5 years in LEO
- On-Board Current & Temperature Monitoring
- On-Board Watchdog
- Double Redundant DC-DC
- TMR and Double Redundant Storage Options
- Custom Daughter Card Connection for SerDes
- Implementing Custom FPGA Processing Design Available
- QML-V & QML-Q Options Available
PROCESSOR
- Microchip PolarFire SoC Flash Based FPGA SoC
- Quad 64-bit RISC-V on FPGA + 1 RISC-V Monitoring Core
- 660MHz per Core offering more than total 4000DMIPS
- Free Eclipse-based SoftConsole Programming IDE and Debug via JTAG for the rapid development of bare metal- and RTOS-based C/C++ software
- Optional 32-bit RISC-V Soft Cores
ENVIRONMENT
- Radiation Tolerance:
- ZeroFIT SEU neutron-immune FPGA
- Total Ionizing Dose: More than 30Krad (Si)
- Internal Block RAM ECC Protected
- Latch-up Immune
- Temperature & Pressure: -40 C to +85 C @ 10-8 bar
- Shocks: ISS CubeSat Deployer Compatible
- Random Vibrations: ISS CubeSat Deployer Compatible
BUDGET
- Dimensions: 146×110×21 mm
- Mass : 600gr
- Power Supply : 5V ±5% or 8V~36V
- Power Consumption: 3W ~ 5W
SOFTWARE SUPPORT
- Design Tools:
- Operating Systems and RTOS:
- Linux, FreeRTOS, GNOME, INTEGRITY, FreeBSD, Azure, Ubuntu, VxWorks, SAFWRTOS, Yocto Project, etc.
PRODUCT DOCUMENTS
- Failure Modes, Effects, and Criticality Analysis (FMECA)
- Reliability Analysis Report
- Radiation Analysis Report
- Safety Assurance Plan
- Fault Tree Analysis (FTA)
- Single Point Failure Analysis (SPFA)
- Worst Case Analysis (WCA)
- Derating Analysis Report
- Availability Analysis Report
- Mechanical Analysis Report
- Maintainability Analysis Report
- Fault Detection, Isolation, and Recovery (FDIR)
- Qualification Test Plan (QTP)
- Environmental Test Reports, TVAC, Vib.
- EMC/EMI Test Report
- Radiation Test Report
- Operational Risk Assessment (ORA)
- Critical Items List (CIL)
- Materials, Processes, and Mechanical Parts List (MPMPL)
- Product Assurance Plan (PAP)
- Configuration Item Data List (CIDL)
- End Item Data Package (EIDP)
- As-Built Configuration List (ABCL)
ADDON CARDS / DAUGHTER BOARDS
- Multiple High speed CameraLink interface
- Serial interface support: Multi-UART or CAN bus card
- Sensor integration: IMU or magnetometer daughtercard
- Image processing: FPGA or GPU compute module
- Storage: SD card expansion or flash memory module
- Communications: S-band/UHF radio transceiver module
- Power management: MPPT or battery monitoring addon
Reliability Cost/ Worth COTS vs. RT
For flight models, a trade-off between reliability and cost is required. OBC-Polar is available in multiple configurations, including COTS-based, partially radiation-tolerant, and fully radiation-tolerant variants. The PolarFire SoC is inherently latch-up immune. For each configuration, component part numbers are shared and a detailed FMEA is performed to identify critical components and assess reliability vs. cost, providing full visibility of the available options to space missions.
Options:
- Baseline: All COTS components
- Tier0: Upgraded parts: Power + protections
- Tier1: Upgraded parts: Power + protections + interfaces + oscillators
- Tier2: Upgraded parts: Power + protections + interfaces + oscillators + MSS DDR4 + QSPI + temp
- Tier3: Upgraded parts: Power + protections + interfaces + oscillators + MSS DDR4 + QSPI + temp + fabric DDR + ADC + Ethernet
- Tier4- Fully Radiation Tolerant
Tier0 (Power / Protection)
- P/N → P/N -SEP class
Tier1 additions (Interfaces + Oscillators)
- P/N → P/N -SEP class
- LVDS: P/N → P/N -SEP class
- Oscillators: COTS XOs → Microchip space XO family
Tier2 additions (Boot / Memory / Sensors)
- P/N → P/N -SEP class
Tier3 additions (Fabric / ADC / Ethernet)
- Fabric DDR: P/N →P/N -SEP class
- ADC: P/N → RT/space ADC option
- Ethernet PHY: P/N → Microchip rad-tolerant GbE PHY option
