Edge-Tartan
PIONEERING SPACECRAFT COMPUTING
The Edge-Tartan is a cutting-edge onboard super computer powered by Artificial Intelligence specifically designed for Cubesat missions. Leveraging the powerful and reliable Microchip PolarFire SoC FPGA technology & NVIDIA Jetson Xavier, this Cubesat OBC provides exceptional performance and versatility for space applications. Whether your mission involves scientific research, Earth observation, or commercial satellite deployment, the Edge-Tartan ensures optimal performance and reliability in the harsh conditions of space.
KEY FEATURES
- GPU (AI): NVIDIA Volta (384 CUDA + 48 Tensor); governed clocks; VRAM 16 GB LPDDR4x (128-bit).
- Performance: up to 21 TOPS (INT8) + >4,000 DMIPS (OBC).
- FPU / DMA: HW FPUs on OBC cores; AXI/SoC DMA (OBC + Jetson).
- Power (modes, typ.): Survival 2–4 W (OBC only) · Nominal 8–12 W · AI 12–18 W · Peak 18–25 W (short duty).
- Input voltage: 9–20 V DC (direct 28 V bus option with onboard DC/DC).
- Additional options: 1–2× SpaceWire, 1–2× GbE, CSI-2 direct sensor ingress, PCIe/SerDes (QSH), up to 4× CAN, up to 4× RS-422/485, secure boot, watchdog & autonomous recovery.
- Thermal requirements: conduction-cooled; keep Jetson Tj ≤ 90 °C; baseplate target ≤ 55–65 °C at peak.
SPECIAL FEATURES
- Estimated LEO lifetime / TID: 3–5 years @ 500–650 km SSO (duty-cycled AI); >30 krad(Si) (analysis behind typical CubeSat shielding). SEU strategy: flash-based PolarFire (config SEU-immune), ECC/EDAC/TMR, MRAM for critical state.
- On-Board Current & Temperature Monitoring
- On-Board Watchdog
- Double Redundant DC-DC
- TMR and Double Redundant Storage Options
- Custom Daughter Card Connection for SerDes
- Implementing Custom FPGA Processing Design Available
- QML-V & QML-Q Options Available
PROCESSOR
- Microchip PolarFire SoC, quad 64-bit RISC-V + monitor, up to ~660 MHz, >4,000 DMIPS.
- Quad 64-bit RISC-V on FPGA + 1 RISC-V Monitoring Core
- 660MHz per Core offering more than total 4000DMIPS
- Free Eclipse-based SoftConsole Programming IDE and Debug via JTAG for the rapid development of bare metal- and RTOS-based C/C++ software
- Optional 32-bit RISC-V Soft Cores
MEMORY
- RAM (OBC): 4 GB ECC DDR (EDAC)
- ROM: Tripple 16Mb or 32Mb MRAM (Total 48Mb or 96Mb)
- Mass memory (OBC): Dual eMMC 256 GB each (mirrored/partitioned, EDAC in stack); MRAM 3×32 Mb; QSPI NOR 2×512 Mb
- Nonvolatile Storage: 64GB SLC Flash via Dual 32GB eMMC
- QSPI Flash: Double 512Mb (Total 1Gb)
- EEPROM: I2C/SPI FRAM & MRAM
- MicroSD Card Slot: For Development and Debug
ENVIRONMENT
- Radiation Tolerance:
- ZeroFIT SEU neutron-immune FPGA
- Total Ionizing Dose: More than 30Krad (Si)
- Internal Block RAM ECC Protected
- Latch-up Immune
- Temperature & Pressure: -40 C to +85 C @ 10-8 bar
- Shocks: ISS CubeSat Deployer Compatible
- Random Vibrations: ISS CubeSat Deployer Compatible
INTERFACES
- DIGITAL/ANALOG:
- Digital I/O : 20~60
- ADC : 8/16CH with 12-bit or 16-bit resolution
- High Speed Interfaces:
- Space Wire : 1 or 2
- 1G Ethernet: 1 or 2
- USB 2.0/3.0
- SerDes: Via QSH Connector for PCIe, JESD, etc.
- Serial Interfaces:
- CAN2.0 : 4
- RS422 and RS485 : 2 to 8
- RS232 : 2 to 4
- I2C : 2 to 4
- SPI : 2 to 4=
BUDGET
- Dimensions: 100×100×≤22 mm
- Mass : 380–520g including conduction plate
- Power Consumption: PolarFire board max 5.5 W; Jetson 10–20 W (workload-dep.)
SOFTWARE SUPPORT
- Design Tools:
- Operating Systems: OBC—Yocto Linux (options: INTEGRITY/FreeRTOS). AI—Ubuntu LTS via JetPack with CUDA/cuDNN/TensorRT, VPI, DeepStream (opt.), Docker containers; Nsight tools.
Libraries/FSW: Klepsydra SDK (KSP/KIPC, ROS 2) and Bright Ascension FSDK/MCS supported.
PRODUCT DOCUMENTS
- Failure Modes, Effects, and Criticality Analysis (FMECA)
- Reliability Analysis Report
- Radiation Analysis Report
- Safety Assurance Plan
- Fault Tree Analysis (FTA)
- Single Point Failure Analysis (SPFA)
- Worst Case Analysis (WCA)
- Derating Analysis Report
- Availability Analysis Report
- Mechanical Analysis Report
- Maintainability Analysis Report
- Fault Detection, Isolation, and Recovery (FDIR)
- Qualification Test Plan (QTP)
- Environmental Test Reports, TVAC, Vib.
- EMC/EMI Test Report
- Radiation Test Report
- Operational Risk Assessment (ORA)
- Critical Items List (CIL)
- Materials, Processes, and Mechanical Parts List (MPMPL)
- Product Assurance Plan (PAP)
- Configuration Item Data List (CIDL)
- End Item Data Package (EIDP)
- As-Built Configuration List (ABCL)
ADDON CARDS / DAUGHTER BOARDS
- Serial interface support: Multi-UART or CAN bus card
- Sensor integration: IMU or magnetometer daughtercard
- Image processing: FPGA or GPU compute module
- Storage: SD card expansion or flash memory module
- Communications: S-band/UHF radio transceiver module
- Power management: MPPT or battery monitoring addon
