A quick insight into the facts behind our products’ reliability and processing power: Polar Edge
A quick insight into the facts behind our products’ reliability and processing power: Polar Edge Microchip’s flash-based PolarFire FPGA SoC combined with NVIDIA Jetson processors offers an ideal platform for AI/ML onboard computing PolarFire FPGA alone makes an attractive flight computers, but paired with NVIDIA processors makes a reliable OBC for satellite & rockets, inherently designed for space environments due to vulnerabilities to Single Event Upsets (SEU), Total Ionizing Dose (TID), and latch-up issues. Remaining challenge is Hi-power consumption of NVIDIA processors, heat management & dimension constraints. We picked up challenges & introduced PolarEdge-High End, A flight proven Edge Computers with different processing power as additional board to our OBC & keeping in CubeSat form factor! OBC-Cube-Polar leverages cutting-edge heat pipe and heatsink technology to accommodate NVIDIA processors effectively. Options to pair with OBC-Polar, Microchip PolarFire FPGA SoC PolarEdge variations
CAVU Aerospace custom daughterboards on OBCs
Addon cards can significantly improve the interface capabilities of a CubeSat onboard computer by expanding its functionality, enhancing data acquisition, and supporting mission-specific hardware. Here’s how they help: Serial interface support: Multi-UART or CAN bus card Sensor integration: IMU or magnetometer daughtercard Image processing: FPGA or GPU compute module Storage: SD card expansion or flash memory module Communications: S-band/UHF radio transceiver module Power management: MPPT or battery monitoring addon
OBC-Polar Rockets Flight Computers, When precision in PCB matters
Flight computers are used in aircraft, spacecraft, drones, and satellites where every cubic centimetre is precious. Design is always a compromise of different constraints: Size & Weight, High Reliability, Radiation Tolerance, Thermal Management, EMI/EMC, Power Efficiency CAVU OBC-Cube Polar is flight proven flight computers for launch vehicles, providing Six Nine reliability index, thanks for multiple redundancy & availability improvement techniques in design. All in 96mm * 96mm dimensions & 18 layers PCB make it very attractive option for aerospace projects! Several compact PCB design techniques have been implemented, along with advancements in manufacturing capabilities, to achieve minimal hole-to-copper clearance Minimum track width 0.102mm Minimum via/hole size 0.15mm Minimum track to via/hole clearance 0.163mm Minimum track to via/hole outer diameter 0.14mm Full X-RAY inspection for all assembled boards with BGA
Latch-Up Protection – Phenomenon and Strategy
Latch-up in CMOS technology is caused by ionizing particles (e.g., heavy ions) creating parasitic paths between power and ground, often forming a parasitic SCR (thyristor structure). Once triggered, this path can sink significant current and damage the device unless interrupted quickly. To protect against this, an LCL circuit is used. It typically relies on: Comparator 1: Detects an overcurrent condition. Comparator 2 + Timer: Measures how long the overcurrent persists. If the current exceeds a defined threshold and lasts longer than the allowed duration, the circuit shuts off the output. Here is a discrete representation of such a protection mechanism, built using standard analog building blocks: While this approach offers flexibility, we more commonly recommend integrated devices for reliability and compactness, especially where flight heritage is important. Flight-Proven Integrated Solutions For rail protection, we typically consider the following radiation-tested parts: TI TPS25940A/L – Excellent for sub-12V rails (3.3V, 5V, 12V); integrates current limit, fault timer, undervoltage/overvoltage, reverse blocking. SEL-free up to 87 MeV·cm²/mg, tested up to 50 krad(Si). ADI/MAX17523 – For 12V–24V range; includes robust protection and is TID and SEL tested. ADI/LTC4222, LTC4361 – Flexible solutions for higher voltages, especially 24V rails; require external N-FETs for higher power levels. MAX14572EUD+ – Accurate OVP/OCP controller with external FET option for thermal/power optimization. For higher power rails (24V/48W), most devices require external FETs. The choice of FET is application-dependent, considering layout, mechanical constraints, thermal management, and assembly processes. Background and Heritage We were among the first teams to evaluate the TI TPS25940x family under space radiation conditions, and the parts have performed exceptionally well. They offer a compact, reliable solution for current-limited protection with minimal external components – ideal for small spacecraft or tight board space. For higher current/power rails, especially at 24V, we recommend solutions with external FETs to scale thermals and dimensions independently of the controller. These designs offer better customization for your specific constraints.
Transformerless Ethernet using Capacitive Coupling in Embedded and Backplane Systems
Transformerless Ethernet using Capacitive Coupling in Embedded and Backplane Systems Ethernet interfaces traditionally use magnetics (transformers) to provide galvanic isolation and common-mode noise rejection. However, in tightly integrated embedded systems or backplane designs, transformerless Ethernet becomes desirable due to:• Board space limitations• Cost and height constraints• Lack of isolation requirement (e.g., shared ground plane)This note explains the principles of transformerless Ethernet using AC coupling, with a focus on the differences between voltage-mode and current-mode PHY drivers, and details practical implementation strategies. Recommendations1. Choose Voltage-Mode PHYs with Internal Termination and AC-Coupling Support2. Use 1000BASE-KX or 1000BASE-CX PHYs for backplane and internal Ethernet3. Avoid transformerless configurations with 1000BASE-T or current-mode PHYs unless the design is well characterized.4. Validate mixed configurations using simulation tools or prototype testing. Full article here: CAVU-OBC-TN-ETHX-001
Product Development Journey
When we say a product is developed, we truly mean it! Nearly all CAVU Aerospace products come with comprehensive analytical reports since 2017. These documents & reports are essential for clients to align our products with their specific mission requirements & assist them in deciding between using COTS or Hi-Rel components to effectively manage costs. We provide the following documents along with our products: Vibration analysis & test reports EMI/ EMC analysis & test reports TVAC test reports Radiation analysis, TID & SEE simulations & test reports Materials, Processes, and Mechanical Parts List (MPMPL) Reliability Analysis Report Radiation Analysis Report Failure Modes, Effects, and Criticality Analysis (FMECA) Single Point Failure Analysis (SPFA) Critical Items List (CIL) Worst Case Analysis (WCA) Derating Analysis Report Availability Analysis Report Fault Detection, Isolation, and Recovery (FDIR)
OBC Radiation Analysis, COTS or Rad-Tol. components ?
For low earth orbit missions, there is always a question how to choose among Rad-Hard, Rad-Tol & COTS components for satellite & launch vehicle avionics. Its a trade-off between cost, lead time & reliability. Component manufacturer is best person to guide developer on radiation analysis. Here is how CAVU AEROSPACE supports client in development stage. Data-input: Orbit, launch data, Satellite or Launch vehicle shielding Our solutions Radiation Analysis, Total Ionizing Dose (TID), Displacement Damage Dose (DDD), and Single Event Effects (SEE), Cost-Weight- Worth analysis, Radiation test reports, Rad sensors in products, SEE mitigation techniques in design stage. Case study: OBC- Polar 2mm thickness AL7075 enclosure box: 6 kRad OBC weight: 220 gr 3mm thickness AL7075 enclosure box: 9 kRad OBC weight: 270 gr 4mm thickness AL7075 enclosure box: 5 kRad OBC weight: 320 gr We have several SEE mitigation techniques in our products (Shielding weight/reliability worth assessment, TMR, ECC, EDAC & components positioning) effectively improves subsystem radiation resilience & reliability or at least help project developers to make decision between COTS or Rad-Tol components. For more information, get in touch with us.
Space data for environmental monitoring will be in much better place in 2025
ESA Biomass satellite will be launched in few days, uses P-band SAR data. P-band SAR data helps monitor trees by using its long wavelengths to penetrate dense forest canopies and gather information about the ground surface, tree structure, and biomass. This data can be used to estimate forest above-ground biomass (AGB), detect deforestation, and assess land degradation. P-band SAR also has the advantage of high capability for resolving high-gradient displacements and strong snow penetration. Here’s a more detailed explanation:Penetration:P-band SAR has a long wavelength (67-139 cm), which allows it to penetrate through dense forest canopies, providing insights into the forest floor and underlying structures. Biomass Estimation:P-band SAR can be used to estimate forest AGB by analyzing the backscattered signal, which is influenced by factors like tree architecture, moisture content, and the arrangement of trees. Deformation and Land Degradation:P-band SAR can detect ground deformation, which can be indicative of land degradation or changes in forest structure. Vertical Structure:P-band SAR tomography allows for the reconstruction of the vertical structure of forests, revealing how the backscattered signal varies with height. Advantages:P-band SAR has the advantage of being able to resolve high-gradient displacements, penetrate snow, and is less sensitive to subtle deformation, making it a valuable tool for forest monitoring.
OBC enclosure box
🚀 When Do We Really Need Enclosure Boxes for PCBs in Satellite and Launch Vehicle Systems? In the mechanical integration of On-Board Computers (OBCs) within satellites and launch vehicles, developers have multiple options:👉 No enclosure box – PCB mounted directly on chassis platforms or rails👉 Aluminum or 👉 Carbon fiber enclosure box The choice depends on key design considerations such as accessibility, weight, vibration resilience, and cost.As an OBC manufacturer, it’s essential to perform detailed mechanical analysis of our PCBs to determine the optimal placement of mounting holes—typically M3 size—and to deliver a tailored mechanical design for every single mission! We conduct vibration analysis for OBCs in design stage to identify critical stress points. This ensures the mechanical reliability of the OBCs in harsh environments, whether they are used without an enclosure or with aluminum or carbon fiber enclosures.✔️ This approach helps prevent project delays and effectively reduces costs associated with testing and operations.
Automated PCB routing, CAVU’s Technical Advantage for Fast Lead Times
Automated PCB routing, CAVU’s Technical Advantage for Fast Lead Times There’s always a reason behind quicker lead times and more competitive prices —it’s the technical advantage! PCB routing is one of the most time-consuming tasks in product design. CAVU technical team spent months searching for AI-assisted automated PCB routing and tried several AI tools that claimed to deliver results. At the end, we had to develop a solution in-house! Now, even designing complex 16+ layer PCBs for our OBC projects takes only a fraction of the time and cost, thanks to our in-house automated PCB routing solution. This help us to deliver projects much faster & more reliable than industry standards. Automated PCB routing refers to the process of automatically determining the layout of electrical connections (routing) between components on a printed circuit board (PCB) using software tools. This process is essential for creating efficient, functional, and manufacturable PCBs. Steps in Automated PCB RoutingComponent Placement: The first step in PCB design is placing all the components on the board. The placement of components affects the routing process, and efficient placement minimizes routing complexity. Routing Algorithms: Once components are placed, routing algorithms are used to connect them based on design rules (such as minimum trace width, spacing, and clearance). Automated tools can use various algorithms, like: Track Routing: Connecting pads with tracks automatically while respecting design rules. Via and Layer Management: Determining when and where to use vias to switch between layers and how to minimize their number. Optimization Algorithms: Algorithms can optimize the routing to minimize the path lengths, reduce the number of vias, and meet electrical performance requirements. Design Rule Check (DRC): This ensures the routing complies with all predefined design rules, such as trace width, spacing, and clearance between traces or pads.
CAVU Aerospace shortlisted for Scotland Technology Award, 2025
CAVU Aerospace shortlisted for Scotland Technology Award, 2025 CAVU Aerospace delivered few groundbreaking projects to industry giants. It involves more than 15 Scottish companies in supply chain to deliver the job. We’ve been shortlisted for technology awards in ScotlandIS 25th birthday.
CAVU Aerospace Showcase OBC Polar at Ignite Space, Leicester 2025
CAVU Showcase OBC Polar in Ignite Space 2025-Leicester CAVU Aerospace UK was proud to participate in the Technology Showcase at Ignite Space 2025, where we presented our latest advancements in onboard computing, launch vehicle processing solutions, and a unified satellite video and image processing platform. The event brought together leading space industry professionals to discuss cutting-edge innovations shaping the future of space exploration and satellite technology. Our team engaged in insightful discussions, reinforcing our commitment to delivering high-reliability solutions for next-generation missions. We thank Balazs Slezak for hosting this dynamic session and everyone who joined us for valuable conversations. CAVU Aerospace UK continues to push the boundaries of space technology—stay tuned for more updates!
The Challenge of AI Processing in Space
As AI technology advances, the demand for onboard processing in CubeSats and small satellites is growing. This article delves into the challenges of AI edge computing in space, particularly the radiation vulnerabilities of NVIDIA Jetson processors, and how CAVU Aerospace UK is pioneering solutions with their Tartan Series Edge Computers.
The Demands of Space Edge Computing
The Demands of Space Edge Computing CAVU Aerospace UK, 2024 – As the space industry rapidly evolves, the demand for robust and efficient space edge computing solutions has never been greater. The primary drivers behind this demand include the exponential growth in satellite launches, the increasing complexity of satellite missions, and the rising volume of data generated by these missions. Traditional methods of data management, which involve sending large amounts of raw data from satellites to ground stations for processing, are becoming less feasible due to bandwidth limitations, latency issues, and the sheer volume of data. Key Factors Driving Demand: Emerging Trends in Space Edge Computing The future of space missions is heavily influenced by several emerging trends in space edge computing, which are aimed at enhancing the efficiency and capabilities of satellite operations. Estimating Data Transfer and Processing Needs Given the projected growth in satellite deployments and the increasing data demands, the total amount of data that needs to be transferred to Earth is expected to rise dramatically. For example, a constellation of Earth observation satellites could generate several petabytes of data annually. If a constellation like ICEYE’s SAR satellites were to generate approximately 4.3 terabytes per day, the annual data output could exceed 1.57 petabytes. When considering the combined data from multiple constellations, the total volume could reach tens of exabytes per year. To handle this data deluge, space edge computing solutions can significantly reduce the amount of data needing transmission. By processing and filtering data onboard, these systems can cut down data transfer volumes by up to 90%, saving costs and reducing the strain on communication infrastructure. Embedded AI Processing Platforms To address the growing need for advanced data processing capabilities in space missions, various embedded AI processing platforms are available, each offering unique advantages in terms of performance, power consumption, and suitability for space applications. This table compares the specifications of leading AI processors, including those from NVIDIA, Google Coral, Teledyne, and others, focusing on their use in CubeSats and small satellites. These processors enable real-time data processing, AI inference, and efficient data management, essential for the operational success of modern satellite constellations. Processor/Platform Processing Power Power Consumption Suitability NVIDIA Jetson AGX Orin Up to 275 TOPS 15W – 60W High-performance tasks, co-processor capable NVIDIA Jetson Orin NX Up to 100 TOPS 10W – 25W NVIDIA Jetson Xavier NX Up to 21 TOPS 7.5W – 15W Moderate AI tasks, co-processor NVIDIA Jetson Orin Nano Up to 40 TOPS 5W – 15W Entry-level AI applications, co-processing Google Coral Edge TPU 4 TOPS (per TPU) 2W per TPU (0.5W/TOPS) Low-power AI inferencing, co-processor Intel Movidius Myriad X Up to 1 TOPS <2W Computer vision, low-power AI tasks Mythic M1076 Up to 25 TOPS 3W – 4W High efficiency AI inference, low power Teledyne Qormino Quad ARM Cortex A72, 1.8GHz Low, exact value not specified Robust processing in compact spaces, radiation tolerant Comparison of AI processors for edge computing It is important to note that most embedded AI processing platforms, except for specific solutions like Teledyne’s Qormino, are not inherently designed for space environments due to vulnerabilities to Single Event Upsets (SEU), Total Ionizing Dose (TID), and latch-up issues. To address the challenges posed by space environments, CAVU Aerospace UK employs a specialized design incorporating Microchip’s flash-based FPGA SoCs, such as the PolarFire series. These SoCs are equipped with robust features including Error Correction Code (ECC), Error Detection and Correction (EDAC), and Triple Modular Redundancy (TMR), which significantly enhance reliability by mitigating effects like Single Event Upsets (SEU). Additionally, Magnetoresistive memories (MRAM) and radiation-tolerant or radiation-hardened versions of the PolarFire SoC are used to safeguard against radiation-induced failures. These measures, combined with distributed processing among co-processors, ensure robust performance and data integrity in the challenging conditions of space. CAVU Aerospace UK’s Space Edge Computing Solutions CAVU Aerospace UK offers a suite of cutting-edge space edge computing solutions, each designed to meet the specific needs of CubeSats and small satellite missions. These solutions integrate the versatile Microchip Flash Based PolarFire SoC with a variety of powerful co-processors, providing a range of performance options to suit different mission requirements: These solutions are specifically tailored to address the complex challenges of space missions, including real-time data processing, cost efficiency, and operational reliability. By leveraging advanced edge computing technologies, CAVU Aerospace UK enables satellite missions to operate more effectively, reduce data transfer costs, and deliver real-time insights from space. As the space industry continues to expand, these solutions are set to play a crucial role in advancing satellite technology and exploration.
