THERMAL CONTROL UNIT - ( TCU )
Thermal Management For Satellite Systems
PIONEERING SPACECRAFT COMPUTING
The CAVU TCU offers efficient thermal management for satellite systems, ensuring reliable performance in space. Using FPGA-based control and radiation mitigation techniques, it optimizes power use for long-duration missions with customizable sensor inputs and heater channels.
KEY FEATURES
- Supports 110 sensor inputs, 50 heaters output
- FPGA-based control with SEU mitigation
- Real-time thermal monitoring and adjustment
- Interface to Thermistors, RTD, etc.
- Fully Customizable
INTERFACES
- Temperature Sensor Input: 110 Analog Input Channels
- Thermistor
- RTD
- Custom Analog
- Heater Driver Output: 50CH Up to 50W Each
- Digital GPIO:
- 8 Inputs / 8 Outputs
- Serial Interfaces:
- CAN2.0: 2
- RS422: 2
- RS485: 1
- RS232:1
ENVIRONMENT
- Radiation Hardness:
- Total Ionizing Dose: 30Krad
- Latch-up Immune
- SEE @ 60MeV
- Temperature & Pressure: -40 C to +85 C @ 10-8 bar
- Shocks: 2000g, 2000-10000Hz
- Random Vibrations: 14g(RMS) 3-Axis , 20~2000Hz
MEMORY
- RAM: 80Mbits MRAM 40 bits width
- ROM: 80Mbits MRAM 40 bits width
- Nonvolatile Flash Memory:
- Total 32Gbit SLC NAND
- 256K Serial FRAM
- 256M Serial NOR
BUDGET
- Dimensions: 160x170x38mm
- Mass: 1.1Kg
- Power Supply: 28V ±4V, Custom Range Available
- Power Consumption: 1.5W ~ 4W
PRODUCT DOCUMENTS
TCU is flight proven onboard computer for number of satellite projects and we have full ECSS/ NASA documentation documents & test reports.
- Failure Modes, Effects, and Criticality Analysis (FMECA)
- Reliability Analysis Report
- Radiation Analysis Report
- Safety Assurance Plan
- Fault Tree Analysis (FTA)
- Single Point Failure Analysis (SPFA)
- Worst Case Analysis (WCA)
- Derating Analysis Report
- Availability Analysis Report
- Mechanical Analysis Report
- Maintainability Analysis Report
- Fault Detection, Isolation, and Recovery (FDIR)
- Qualification Test Plan (QTP)
- Environmental Test Reports, TVAC, Vib.
- EMC/EMI Test Report
- Radiation Test Report
- Operational Risk Assessment (ORA)
- Critical Items List (CIL)
- Materials, Processes, and Mechanical Parts List (MPMPL)
- Product Assurance Plan (PAP)
- Configuration Item Data List (CIDL)
- End Item Data Package (EIDP)
- As-Built Configuration List (ABCL)
